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Hardware and Performance / Deciso DEC690: thermal design
« on: February 13, 2022, 11:50:47 am »
Hello,
I have upgraded my DEC690 from 8GB DDR3L to 16GB DDR3L with ECC, and added a second SSD of 1TB to the original 256GB SSD. After reassembling, I encounter cooling issues with the CPU. The design of the thermal contact between the CPU and the heat-sink does not provide a natural mechanical contact pressure, so that thermal paste or even thermal adhesive pads are not providing the required performance. Even with thermal glue, the results are not acceptable.
Does anyone know which material Deciso has used to provide an acceptable thermal conductivity between the CPU and the heat-sink? To my opinion, the thermal design is quite sub-optimal, because there is no controlled pressure applied in this zone (i.e., no screws or anything playing the same role).
Bonus question: if somebody knows how to check that ECC is really used, I would also be very interested. I tried with dmdidecode and with memtest86+, but no information related to memory (first) or ECC (second) could be displayed.
Best regards,
Vincent
I have upgraded my DEC690 from 8GB DDR3L to 16GB DDR3L with ECC, and added a second SSD of 1TB to the original 256GB SSD. After reassembling, I encounter cooling issues with the CPU. The design of the thermal contact between the CPU and the heat-sink does not provide a natural mechanical contact pressure, so that thermal paste or even thermal adhesive pads are not providing the required performance. Even with thermal glue, the results are not acceptable.
Does anyone know which material Deciso has used to provide an acceptable thermal conductivity between the CPU and the heat-sink? To my opinion, the thermal design is quite sub-optimal, because there is no controlled pressure applied in this zone (i.e., no screws or anything playing the same role).
Bonus question: if somebody knows how to check that ECC is really used, I would also be very interested. I tried with dmdidecode and with memtest86+, but no information related to memory (first) or ECC (second) could be displayed.
Best regards,
Vincent